TNSCi

 

 

Kyocera provides advanced high-density, multilayered PWBs achieving high-precision, ultra-fine wiring and high aspect ratios based on our technologies.

 

Kyocera also offers high-density and high-functionality semiconductor package substrates. Flip chip (FC) with multi-pin, high-density functions required in ASICs, CPUs, and GPUs. Supports lead- and halogen-free mounted packaging substrates.

 

 

 

 

http://www.kyocera-cs.co.jp/english/